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AI / ML

AI Hardware Engineering Intern

Intel

FresherOn-site · 2 LocationsFull timeListed 2d ago
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HQ

🇺🇸 Santa Clara, CA, United States

Open roles

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About the role

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Job Details: Job Description: About the Job Intel is seeking exceptional Computer Science, Electrical Engineering, Computer Engineering, and AI/ML students to join an AI Hardware Engineering internship focused on the future of AI inference and AI infrastructure with hardware/software co-design expertise. This…

What you will do

  • Conduct technical research on the next generation of AI infrastructure, including CPUs, GPUs, AI accelerators, ASICs, memory systems, networking, storage, rack-scale architecture, power delivery, cooling, and cluster management.
  • Analyze GenAI and agentic AI workloads to understand their hardware implications.
  • Evaluate the hardware behavior of AI inference pipelines, including the distinct demands of prompt processing/prefill and token generation/decode.
  • Identify product and system gaps that may limit Intel's ability to serve AI customers effectively.
  • Benchmark and compare relevant AI hardware and infrastructure approaches across performance, power efficiency, cost, programmability, memory hierarchy, scalability, ecosystem maturity, and workload fit.

What they are looking for

  • Currently pursuing a PhD in Computer Science, Computer Engineering, Electrical Engineering, AI/ML, Systems Engineering, or a related technical discipline.
  • Strong foundation in computer architecture, operating systems, distributed systems, parallel computing, AI/ML systems, high-performance computing, or systems software.
  • Familiarity with generative AI models and inference concepts, including transformers, attention, token generation, model serving, quantization, batching, KV cache, long-context workloads, and latency-throughput trade-offs.
  • Experience programming in one or more of the languages - C, C++, Rust, CUDA, SYCL, OpenCL, or a comparable low-level or performance-oriented language.
  • Strong academic performance with a cumulative GPA of 3.0 or higher required.

Nice to have

  • Coursework, research, or project experience in computer architecture, VLSI, digital design, ASIC/FPGA systems, compilers, kernel development, GPU programming, distributed systems, high-performance computing, or AI systems.
  • Experience using profiling, tracing, or benchmarking tools to evaluate CPU, GPU, accelerator, network, memory, storage, or software performance.
  • Familiarity with AI hardware platforms such as Intel Xeon processors, Intel GPUs, NVIDIA GPUs, AMD GPUs, TPUs, custom AI accelerators, FPGAs, or domain-specific inference ASICs.
  • Understanding of memory hierarchies and performance concepts, including cache behavior, DRAM, HBM, memory bandwidth, memory capacity, latency, data locality, DMA, and data movement.
  • Experience with inference frameworks or runtimes such as vLLM, SGLang, Hugging Face Transformers, PyTorch, Triton, or Ray.
  • Familiarity with AI systems infrastructure such as Linux, containers, Kubernetes, distributed storage, RDMA over Ethernet, InfiniBand, CXL, PCIe, NVMe, UALink/eSUN based interconnects, silicon photonics and cluster-management software.
  • Some experience with simulation, modeling, emulation, RTL, FPGA prototyping, firmware, driver development, or low-level debugging.
  • Some experience contributing to open-source systems, ML infrastructure, compiler, kernel, framework, or performance-engineering projects.

Benefits

  • Competitive pay
  • Stock bonuses
  • Health programs
  • Retirement programs
  • Vacation
Computer architectureOperating systemsDistributed systemsParallel computingAI/ML systemsHigh-performance computingGenerative AI inferenceLow-level or performance-oriented programmingCC++RustCUDASYCLOpenCLPyTorchHugging Face Transformers
Full posting text

Job Details:

Job Description:

About the Job

Intel is seeking exceptional Computer Science, Electrical Engineering, Computer Engineering, and AI/ML students to join an AI Hardware Engineering internship focused on the future of AI inference and AI infrastructure with hardware/software co-design expertise.

This internship approaches AI infrastructure as a hardware/software co-design challenge. The intern will analyze how model architecture, inference behavior, memory movement, data-center constraints, and software stacks influence end-to-end customer outcomes, including throughput, latency, time-to-first-token, tokens per second, power consumption, utilization, total cost of ownership, and deployability.

The successful candidate will be technically hands-on, capable of independent research and analysis, and comfortable working within a highly technical team of researchers and engineers addressing complex AI hardware and infrastructure challenges.

What You Will Do

Conduct technical research on the next generation of AI infrastructure, including CPUs, GPUs, AI accelerators, ASICs, memory systems, networking, storage, rack-scale architecture, power delivery, cooling, and cluster management.

Analyze GenAI and agentic AI workloads to understand their hardware implications, including transformer architecture based inference, mixture-of-experts architectures, multimodal models, real-time interactive inference, and distributed serving.

Evaluate the hardware behavior of AI inference pipelines, including the distinct demands of prompt processing/prefill and token generation/decode, memory capacity, memory bandwidth, KV-cache management, compute utilization, interconnect bandwidth, and latency. For example, cluster architecture around optimizing both prefill and decode through hardware, memory, and system co-design.

Identify product and system gaps that may limit Intel's ability to serve AI customers effectively, including hardware capabilities, developer tooling, performance libraries, reference architectures, deployment models, observability, and ecosystem enablement.

  • Expertise in modern high-performance CPU, GPU, or AI accelerator architecture and hardware/software interactions.
  • Support Silicon HW programs through multiple phases of the silicon lifecycle, with end-to-end chip execution from concept to silicon.
  • Good understanding with firmware codebases, compilers, kernels, serving stacks and model architectures.
  • Familiar with driving silicon design for subsystems and/or top-level functions with ASICs and SOCs from an architecture specification to production silicon including memory subsystems and interconnects: scale up, scale out, scale across, power management , liquid cooling at rack scale level, deep system level observability & telemetry and dependent impact into Gen AI and LLM level performance/tco/execution KPIs

Develop technical recommendations for what Intel should build, optimize, enable, partner on to meet AI customer requirements based on deep understanding of customer use cases, workload performance, and ML systems research.

Benchmark and compare relevant AI hardware and infrastructure approaches across performance, power efficiency, cost, programmability, memory hierarchy, scalability, ecosystem maturity, and workload fit.

Develop technical models, simulations, prototypes, or analysis tools to evaluate hardware/software trade offs for AI workloads.

Investigate system bottlenecks across compute, memory, networking, storage, and software orchestration, and propose methods to improve end-to-end AI workload performance.

Work with Intel technical teams and external ISVs to collect data on model requirements, inference bottlenecks, deployment challenges, hardware optimization opportunities, and customer priorities.

Engage with AI software ecosystem partners, including model providers, inference-engine developers, cloud providers, framework teams, and ISVs, to understand how their stacks interact with underlying hardware.

Good understanding of modern AI software layers, including PyTorch, Hugging Face Transformers, vLLM, SGLang, model serving, TensorRT-LLM, Triton, Kubernetes, and Neocloud design efficiencies.

Present findings through architecture diagrams, benchmark analyses, technical reports, design recommendations, and executive-ready presentations.

Qualifications:

Minimum Qualifications

Currently pursuing a PhD in Computer Science, Computer Engineering, Electrical Engineering, AI/ML, Systems Engineering, or a related technical discipline.

Strong foundation in computer architecture, operating systems, distributed systems, parallel computing, AI/ML systems, high-performance computing, or systems software.

Familiarity with generative AI models and inference concepts, including transformers, attention, token generation, model serving, quantization, batching, KV cache, long-context workloads, and latency-throughput trade-offs.

Experience programming in one or more of the languages - C, C++, Rust, CUDA, SYCL, OpenCL, or a comparable low-level or performance-oriented language.

Strong academic performance with a cumulative GPA of 3.0 or higher required.

Preferred Qualifications

Coursework, research, or project experience in computer architecture, VLSI, digital design, ASIC/FPGA systems, compilers, kernel development, GPU programming, distributed systems, high-performance computing, or AI systems.

Experience using profiling, tracing, or benchmarking tools to evaluate CPU, GPU, accelerator, network, memory, storage, or software performance.

Familiarity with AI hardware platforms such as Intel Xeon processors, Intel GPUs, NVIDIA GPUs, AMD GPUs, TPUs, custom AI accelerators, FPGAs, or domain-specific inference ASICs.

Understanding of memory hierarchies and performance concepts, including cache behavior, DRAM, HBM, memory bandwidth, memory capacity, latency, data locality, DMA, and data movement.

Experience with inference frameworks or runtimes such as vLLM, SGLang, Hugging Face Transformers, PyTorch, Triton, or Ray.

Familiarity with AI systems infrastructure such as Linux, containers, Kubernetes, distributed storage, RDMA over Ethernet, InfiniBand, CXL, PCIe, NVMe, UALink/eSUN based interconnects, silicon photonics and cluster-management software.

Some experience with simulation, modeling, emulation, RTL, FPGA prototyping, firmware, driver development, or low-level debugging.

Some experience contributing to open-source systems, ML infrastructure, compiler, kernel, framework, or performance-engineering projects.

Job Type:

Student / Intern

Shift:

Shift 1 (United States of America)

Primary Location:

US, California, Santa Clara

Additional Locations:

US, California, Folsom

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel .

Annual Salary Range for jobs which could be performed in the US: $100,598.00-100,602.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

*

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

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Internship terms

Stipend
$1,00,598/mo
Deadline
Closing in 40d · 4 Dec

As stated by the source. Anything not shown was not stated.

Intel

Semiconductor Manufacturing

Our mission is to shape the future of technology to help create a better future for the entire world, that’s the power of Intel Inside. With more ingenuity and creativity inside, our work is at the heart of countless innovations. From major breakthroughs to things that make everyday life better— they’re all powered by Intel technology. With a career at Intel, you can help make the future more wonderful for everyone. • Need help or have a support question? Visit Intel Support: http://ms.spr.ly/6054tmaop .

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